Website:
bestnanotech.in
Job details:
Package Equipment Engineering Manager / Lead Semiconductor Manufacturing
Location: Ahmedabad, Gujarat, India
Work Mode: Onsite
Employment Type: Full-Time
Experience: 12 18 Years
Industry: Semiconductor / ATMP / OSAT / IC Packaging
Role Overview
We are looking for a Package Equipment Engineering Manager/Lead to manage equipment engineering for high-volume semiconductor assembly and packaging operations. The role will own equipment installation, qualification, performance, availability, maintenance strategy and continuous improvement across assigned packaging process areas.
The position requires hands-on experience with semiconductor assembly equipment, strong equipment troubleshooting capability and demonstrated leadership of engineers, technicians and equipment-improvement programs.
Key Responsibilities
- Lead the package equipment-engineering team supporting 24 7 semiconductor manufacturing operations.
- Own equipment performance across die preparation, die attach, wire bonding, molding, marking and package singulation.
- Manage equipment installation, setup, acceptance testing, qualification and production release.
- Develop equipment specifications, user requirements and technical acceptance criteria.
- Coordinate equipment hook-up, safety checks, calibration and process qualification activities.
- Establish preventive, predictive and condition-based maintenance strategies.
- Improve equipment availability, utilization, OEE, mean time between failures and mean time to repair.
- Lead technical troubleshooting for chronic equipment failures, process excursions and production interruptions.
- Use equipment data, alarms, logs and failure history to identify performance-improvement opportunities.
- Develop maintenance procedures, spare-parts strategies, equipment checklists and escalation mechanisms.
- Manage equipment vendors during installation, warranty support, upgrades and corrective actions.
- Partner with process engineering to improve equipment capability, repeatability and process control.
- Support new-product introduction, capacity expansion and production ramp-up requirements.
- Drive equipment automation, sensor integration, data collection and predictive-maintenance initiatives.
- Lead equipment modifications, retrofits, cost reduction and productivity-improvement projects.
- Ensure compliance with EHS, equipment-safety, cleanroom and quality requirements.
- Build technical capability through recruitment, training, mentoring and competency development.
- Prepare performance dashboards and communicate equipment risks, recovery plans and capital requirements.
Required Qualifications
- Bachelor s or Master s degree in Mechanical, Electrical, Electronics, Mechatronics, Instrumentation, Automation Engineering or a related discipline.
- 12 18 years of equipment-engineering experience in semiconductor assembly, packaging, ATMP, OSAT or IDM backend manufacturing.
- At least 4 6 years of experience leading equipment engineers, technicians or major equipment programs.
- Strong hands-on experience with multiple semiconductor packaging equipment platforms.
- Demonstrated experience in equipment installation, qualification and high-volume manufacturing support.
- Proven record of improving OEE, equipment availability, MTBF, MTTR and manufacturing capacity.
- Experience managing equipment vendors, service contracts, spare parts and technical escalations.
- Ability to support production and equipment escalations in a 24 7 manufacturing environment.
Technical Skills Semiconductor Packaging Equipment
- Wafer mounters and backgrinders
- Wafer saw and dicing systems
- Die sorters and pick-and-place systems
- Die bonders and die-attach equipment
- Wire bonders
- Flip-chip bonders
- Underfill and dispensing systems
- Transfer or compression molding equipment
- Trim-and-form systems
- Laser marking equipment
- Package saw and singulation systems
- Inspection and material-handling equipment
Equipment Engineering
- Equipment installation and commissioning
- Site Acceptance Test and Factory Acceptance Test
- Equipment qualification and production release
- Equipment capability analysis
- Preventive and predictive maintenance
- Condition monitoring
- Calibration and metrology
- Equipment modification and retrofit
- Troubleshooting and fault isolation
- Spare-parts and lifecycle management
Automation and Controls
- PLC and industrial controls
- Servo and motion-control systems
- Sensors, pneumatics and robotics
- Machine vision
- Equipment software and alarm systems
- SECS/GEM
- Equipment data collection
- Manufacturing Execution Systems integration
- Automated material handling
- Predictive-maintenance analytics
Reliability and Improvement Tools
- Overall Equipment Effectiveness
- Mean Time Between Failures
- Mean Time to Repair
- Failure Mode and Effects Analysis
- Root-cause analysis
- 8D problem-solving
- Fault Tree Analysis
- Pareto analysis
- Total Productive Maintenance
- Statistical Process Control
Leadership Responsibilities
- Build and lead a capable package equipment-engineering organization.
- Establish equipment ownership across process modules and production lines.
- Define escalation procedures and technical response requirements.
- Develop engineers and technicians through structured training and mentoring.
- Manage staffing, shift coverage and on-call support for continuous operations.
- Coordinate equipment resources during installation, capacity ramp and critical failures.
- Establish vendor-performance and equipment-maintenance review mechanisms.
Key Performance Indicators
The Position Will Be Responsible For Improving
- Equipment availability
- Overall Equipment Effectiveness
- Mean Time Between Failures
- Mean Time to Repair
- Equipment utilization
- Unplanned downtime
- Preventive-maintenance compliance
- Equipment-related yield loss
- Units per hour
- Maintenance cost
- Spare-parts availability
- Capacity and production readiness
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