- Experience
- 8+ yrs
- Location
- Salem, New Hampshire, United States
- Job type
- Full-time
Required skills
- Design of Experiments (DOE)
- FEA
About the role
BS in mechanical engineering, material science, or related field with 8+ years semiconductor or photonics die packaging experience; knowledge of die attach, wire bonding, flip chip, seam seal, laser mark; ability to lift 20 lbs; cleanroom attire required.
About GPD Optoelectronics Corp.
U.S. manufacturer of InGaAs and germanium photodiodes and custom optical detectors for aerospace, defense, telecom, and industry.
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