Tata Electronics
Website:
tataelectronics.com
Job details:
- Responsible for the technology and process development for the Flip Chip product packaging eg
FOL: Back grinding, Laser groove, Mechanical sawing, SMT & Flip Chip Attach, Mass Reflow/TCB/Fluxless, Flux Cleaning, Plasma Clean, Underfill and
EOL: Mold Underfill, Ball Attach, Saw Singulation, O/S, FVI, Pick and Place & Packing.
- Understand, integrate and innovate to meet customers’ packaging requirements into a cost competitive DFM solution.
- Initiate and engage in technical discussion with vendors to gather all relevant data, review and complete the initial analysis for final decision submission.
- Involvement in the selection of 4Ms based on latest performance and previous experience/learnings.
- Install, buy-off and qualify the given processes and products for development, NPI and LVM.
- Continuous Strive for meeting highest degree of packaging difficulty, ease of DFM to meet BEST customer desired outputs, best in class Yield, best Quality in the industry.
- Offer wide range of BOM selection to cater to different customer requirement.
- Execution of multiple department projects.
- Identify all process controls requirements and use the BKM for inputs & outputs data gathering/controls.
- Assist in the MES, Automation of material, process and recipe controls.
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