Qualcomm
Website:
qualcomm.com
Company:
https://www.linkedin.com/company/qualcomm
Seniority: Mid-Senior level
Industries: Software Development
Job details:
Role Summary
Lead the architecture and delivery of end-to-end SoC power, performance, and thermal limit management solutions. This role drives cohesive HW–FW–SW co-design to protect silicon health while maximizing sustained performance across workloads, process corners, and form factors.
Key Responsibilities
- Define system-level power, thermal, voltage, and current limits, integrating hardware triggers, firmware policies, and software mitigations.
- Architect real-time telemetry and sensing (Voltage, Current, Temperature, Aging) to monitor silicon behavior and enable fast, reliable mitigations.
- Standardize Power Telemetry, Estimators, Droop Detectors, and Thermal monitors across IPs and platforms.
- Drive evolution of power and thermal sensing IPs and trigger mechanisms for rising current density and thermal constraints.
- Define performance-impact profiles for power and thermal mitigations (throttling, DVFS, clock modulation, workload shaping).
- Lead post-silicon validation, correlating physical silicon behavior with architectural intent.
- Build cross-functional consensus (HW, FW, OS, Power SW) and drive ROI-based roadmap decisions.
Qualifications
- BS in EE/CE/CS (MS/PhD preferred).
- 7+ years in SoC power, performance, and thermal management or low-power architecture.
- Experience from architecture through post-silicon productization.
- Expertise in areas such as peak power, PDN droop, thermal management, adaptive DVFS, and reliability monitors.
- Strong cross-functional leadership and technical influence.
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