Equipment Engineer (RDPC - 3DIC)

Job Responsibilities 1. Handling Nano Diffusion, Thin Film, Lithography or Etching and stacking equipment. 2. Troubleshooting and repairing high-tech equipment. 3. Enhancing the efficiency of the equipment to improve production yield. 4. Planning and executing analysis projects or defect detection. 5. Collaborating with cross-functional engineers or vendors to ensure smooth operations.

Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company.