Equipment Engineer (RDPC - 3DIC)
TSMC
- Location
- Taiwan
About the role
Job Responsibilities
1. Handling Nano Diffusion, Thin Film, Lithography or Etching and stacking equipment.
2. Troubleshooting and repairing high-tech equipment.
3. Enhancing the efficiency of the equipment to improve production yield.
4. Planning and executing analysis projects or defect detection.
5. Collaborating with cross-functional engineers or vendors to ensure smooth operations.
About TSMC
Taiwan Semiconductor Manufacturing Company Limited is a Taiwanese multinational semiconductor contract manufacturing and design company.
This page is fully interactive when JavaScript is enabled. Please enable JavaScript to apply or browse related roles.