EnCharge AI
Website:
enchargeai.com
Job details:
SoC Floorplan Lead - Principal Engineer / Senior Staff
www.EnchargeAi.com
The 10 Hottest Semiconductor Startups Of 2025 (So Far)
https://www.crn.com/news/components-peripherals/2025/the-10-hottest-semiconductor-startups-of-2025-so-far?page=11
https://www.enchargeai.com/blog/the-efficiency-imperative-energy-will-define-ais-next-chapter
The Role
We are seeking a highly skilled and hands-on SoC Floorplan Lead to own the physical foundation of our next-generation AI and Data Center SoCs. In this critical role, you will be the bridge between architecture, logic design, and physical design. You will work hand-in-hand with Chip Architects and RTL Leads to influence micro-architecture and ensure the physical implementation achieves best-in-class Power, Performance, and Area (PPA).
If you love solving complex spatial puzzles on advanced technology nodes, integrating sensitive analog components, and driving execution in a high-energy start-up environment, this is the role for you.
Key Responsibilities
- Top-Level Floorplanning: Own the SoC-level floorplan from concept to tape-out for high-performance, large-scale AI/Data Center chips on advanced process nodes (e.g., 5nm, 3nm or below).
- Architecture & RTL Collaboration: Partner closely with Architecture and RTL teams to provide early physical feasibility feedback. Drive block partitioning, shape optimization, and data-flow planning to achieve the absolute best PPA.
- Bump & Package Co-Design: Lead bump planning and IO ring definition. Work with packaging teams on flip-chip/advanced packaging constraints, ensuring optimal signal escape and power delivery.
- Custom & Analog Routing: Manage the placement and custom routing strategies for critical Analog/Mixed-Signal (AMS) IPs, high-speed SerDes (PCIe, Ethernet, Memory interfaces), PLLs, and sensitive clock distributions.
- Power Delivery Network (PDN): Design and analyze the top-level power grid, ensuring robust power delivery for high-current AI workloads while minimizing IR drop.
- Pin Assignment & Feedthroughs: Manage macro placement, block-level pin assignments, and top-level feedthrough planning to optimize global timing and routing congestion.
- Methodology Development: Build and maintain scalable Floorplanning workflows and scripts (Tcl, Python) tailored for a lean, fast-moving start-up team.
Required Skills & Qualifications
- Experience: 12 -20 years years of hands-on experience in Physical Design SoC Floor planning preferably in Datacenter domain, with at least 3 years acting as a lead or primary owner of SoC-level Floorplanning.
- Domain Expertise: Proven track record of taping out large, complex chips—specifically for Data Center, Networking, or AI/Machine Learning applications.
- Start-Up Mentality: Highly driven, self-motivated, and comfortable with ambiguity. You take extreme ownership of your domain, pivot quickly when needed, and roll up your sleeves to get things done.
- Technical Depth:
- Deep understanding of how RTL structures and architectural decisions impact physical design PPA.
- Extensive experience with bump planning, flip-chip package requirements, and die-to-package co-optimization.
- Strong knowledge of analog/mixed-signal IP integration, shielding, and custom routing constraints.
- Expertise with industry-standard physical design tools ( Cadence Innovus).
- Education: BS, MS, or Ph.D. in Electrical Engineering, Computer Engineering, or a related field.
Preferred Qualifications
- Experience with multi-die / chiplet integration (2.5D, 3D packaging, interposers, UCIe).
- Strong scripting and automation skills (Tcl, Python, Perl, Makefile).
- Knowledge of advanced clocking architectures (H-trees, meshes) for highly synchronous AI fabrics.
What We Offer
- Impact: The opportunity to build ground-up architecture and see your ideas taped out in cutting-edge silicon.
- Equity: Competitive start-up equity packages—when the company wins, you win.
- Culture: A flat, collaborative, and bureaucracy-free environment surrounded by top-tier industry veterans.
Skills
2.5D
3D
UCIe
Tcl
Python
Perl
Makefile
Innovus (Cadence )
Bump
PPA
SoC
Floorplanning
Datacenter
Networking
AI
ML
DL
Full-chip
AMS
Serdes
PCIe
Ethernet
DDR7
LPDDR5
Voltus
Redhawk
Contact:
Uday
Mulya Technologies
muday_bhaskar@yahoo.com
www.mulyatech.com
Click on Apply to know more.