Mulya Technologies
Website:
mulyatech.com
Job details:
Senior Package Design Engineer,
Location: Greater Hyderabad / Greater Bangalore
we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption.
Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient. Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale.
our architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future.
. Location: Hyderabad/Bangalore
We are actively seeking a Package Design Engineer, based in Hyderabad OR Bangalore
Responsibility and Authority
- Complete all Package design activities within the given time frame as defined by the project deliverables.
- Complete Package design review processes with the Assembly subcons to ensure no design rule violations.
- Liaise closely with the respective IC layout Engineers during Package design phase.
- Complete verification of Electrical characteristics of the package and unit design using available SW Tools.
- Ensure cost effective methodologies are incorporated into our BGA substrate and LF designs (Multi Layer / Mechanical Drill / Plating Lines etc).
- Provide support, guidance and instructions to Assembly / Package related activities, questions and issues.
- Present detailed weekly reports of activities and progress to the cross-functional team.
- Work with multi-functional groups including product design, engineering and marketing to ensure our package design/technology requirements are fully supported by our assembly partners.
Required Competencies – Experience
- Minimum 5 years experience in IC Package Design using Cadence APD / SIP.
- Hands on experience using Cadence (Virtuoso / Extract IM / Power DC ) / Ansys SW Tools (SiWave / Q3D ) or similar tools.
- Experience using AutoCAD tool.
- Knowledge about various Electronic IC Packaging technology is a must.
- Basic understanding of Thermal and Mechanical behaviour of IC Packages.
- Basic understanding of IC physical layout is beneficial.
Required Competencies – Skills
- Proven top-level Package design and RLC extraction experience.
- Ability to perform package parasitics extraction.
- Strong task management & planning ability. Proficiency in estimating timescales for design completion.
- Able to work to tight and variable time scales
- Strong interpersonal and communication skills.
- Good networking, negotiation and influencing skills
- Adept at managing communication with assembly subcontractors.
If this is the role you have been looking for and you want to be part of a growing Company, with an exciting future then we would really love to hear from you
Contact
Uday
muday_bhaskar@yahoo.com
Mulya Technologies
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