Senior Manager, Package Design Engineering
Renesas Electronics
- Experience
- 12+ yrs
- Location
- Tempe, Arizona, United States
- Job type
- Full-time
About the role
Master's or Bachelor's in Physics, Chemistry, Mechanical, Electrical, or Materials Engineering; 12-15 years semiconductor package development experience with technical/project leadership; strong understanding of power SiP/modules, wafer-level and flip-chip packaging; ability to lead cross-functional teams.
About Renesas Electronics
Global provider of embedded semiconductor and system solutions.
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