HW Program Manager/Sr Prog Manager - CPU

General Summary The Technical Program Manager develops, defines, and executes comprehensive program plans, including schedules, budgets, resources, deliverables, and risk management. They oversee the program from initiation through delivery, coordinating with internal and external stakeholders across multiple functions on technical matters. The role monitors budget adherence, ensures on-time delivery, and tracks achievement of program milestones. The TPM acts as the program's representative, driving alignment and collaboration among all stakeholders. Minimum Qualifications Bachelor's degree in Engineering, Computer Science, or a related field. 2+ years of program management or related experience (minimum). Preferably 4+ years of experience for roles managing complex technical programs. Key Responsibilities Own and drive technical program management for Oryon CPU Engineering, delivering key Qualcomm SoCs, including Snapdragon Elite X and Snapdragon 8 Elite. Coordinate, plan, and lead CPU IP development, testing, and delivery to SoC in partnership with cross-functional engineering teams. Negotiate schedules, scope, and resource allocation to meet aggressive timelines for delivering high-performance, efficient CPUs. Organize and lead cross-departmental discussions to set milestones, schedules, plans of record, and define project tasks. Establish and enforce program policies and processes to ensure smooth execution. Manage the relationship between IP teams and SoC integration teams. Troubleshoot program risks and issues; develop alternative tasks, schedules, and resource plans to resolve conflicts. Proactively identify risks, develop mitigation strategies, and communicate status to internal and external stakeholders. Regularly report key milestones, budgets, metrics, risks, and mitigation plans to senior management and executives. Develop and implement process improvements to boost team productivity and efficiency. Manage teams through the full hardware lifecycle: design, development, validation, test, manufacturing, deployment, and sustainment. Serve as a program advocate in cross-functional and stakeholder meetings, driving alignment and commitment.

QUALCOMM CDMA Technologies (QCT) is the largest provider of 3G chipset and software technology in the world, with chipsets shipped to more than 50 customers and powering the majority of all 3G devices commercially available. QCT partners with nearly 60 3G network operators around the globe and has the largest CDMA engineering team in the wireless industry. QCT provides complete chipset solutions and integrated applications from the Launchpad suite of advanced technologies. Our integrated solutions offer device manufacturers reduced bill-of-materials costs, time-to-market, and development time. Mobile handsets powered by QCT chipsets can offer more features while maintaining a smaller, sleeker form-factor and benefiting from reduced power demands. QCT values collaboration with its customers and partners and works closely with them to enable their success. We offer a wide range of tools to support the device development process, and develop new technologies based on the needs and demands of the wireless market. Devices for all market segments can now include features enabled by 3G wireless technology, in demand by a growing and increasingly sophisticated wireless community.