Role Description:
- Assist FA engineers in performing failure analysis on customer’s RMA returns and internal engineering requests
- Learn and perform hands-on in electrical fault isolation and defect characterization at both IC (or silicon level) and power supply
- Inspect and document incoming RMA returns both at IC’s and Power Supply levels
- Support electrical debugging activities, including performing impedance measurements, ATE test, and curve tracing of IC’s
- Work with senior engineers to analyze test data and perform physical analysis (e.g., optical microscopy and CSAM/SEM imaging)
- Support FA engineers in data collection, documentation and contribution to technical reports
Expected Learning Outcomes:
- Gain hands-on experience in semiconductor failure analysis workflows
- Develop understanding of electrical fault isolation and physical analysis techniques
- Learn to interpret I-V curve and ATE test datalogs
- Build practical knowledge of FA tools such as XRAY, CSAM, probing systems, SEM/FIB
- Learn technical reporting and communication skills
- Develop collaboration experience in engineering environments
Deliverables:
- Document failure analysis findings with observations and preliminary conclusions
- Data summaries and failure trend insights
- Contributions to root cause analysis under engineer supervision
- Presentations summarizing internship work or failure case studies
Qualifications & Requirements
Required Skills:
- Fundamental knowledge of analog and digital circuits
- Basic understanding of semiconductor device physics and IC fabrication processes
- Exposure to lab tools such as curve tracer, Oscilloscopes, Source meters, and DMM
- Basic technical report writing and documentation skills
Preferred Skills:
- Completed academic projects that required using S/W tools such as Cadence/Synopsis, MATLAB, Spice etc.. to design, simulate, assemble, and test the design at final products
- Hands-on lab or academic project experiences in device/PCB level characterization
- Familiarity with IC/PCB-level schematics and layout
- Understanding of analog, mixed-signal, or power IC operation
- Exposure to some failure analysis techniques such as optical micro-scopes, XRAY, and SEM
Education Level: 3rd year Bachelors or Masters Degree
Field(s) of Study: Electrical/Electronics Engineering, Power Electronics Engineering