SiMa.ai
Website:
sima.ai
Job details:
Description
Job Title: MTS, Physical Design
Job Location: Bangalore, India (This position requires a full-time, on-site presence in our Bangalore,
India Office)
Job ID: AI2532
Job Description
Role & responsibilities:
- Hands-on Testchip/SoC/Full-chip floorplanning, integration and P&R alongwith P&R Flow Development.
- Establishes the integration plans for die with optimization for package and board constraints.
- Bump planning, Die file generation, closing loop with package team on signal and power bump placement restrictions.
- Derive specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies.
- Have good understanding on, die-per-reticle/good-die-per-wafer maximization, and right technology selection on metal layers usage maximization.
- Performs integration of all dies in a package and completes the relevant checks before tape-out.
Minimum Requirements
- BE/BTech with at least 10+ years of experience on high complexity SoC designs. At least one SoC in 7nm or lower.
- Demonstrating knowledge and implementation strategies to create an IO ring in accordance with design specifications.
- Possessing knowledge of ESD, latch-up, and other foundry requirements, as well as placement strategies.
- PG creation and push-down methodologies.
- Understanding Analog components and their placement requirements according to design specifications.
- Demonstrating RDL knowledge and working with packaging for SoC floorplan design.
- Following expertise is a plus:
- In-depth knowledge of Physical Verification tools like Synopsys ICV & Calibre Physical Verification Tools
- Knowledge of Package PV checks, IO/Bump PV cleanup, PV rules viz. Antenna, Density, DFM, DFY, DPT at lower technology nodes 7nm or less.
Personal Attributes
Can-do attitude. Strong team player. Curious, creative and good at solving problems. Execution and results-oriented. Self-driven, Thinks Big and is highly accountable. Good communication skills.
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