Mobile Hardware and Chip-Level Repair Engineer (Contract – Immediate Joiner)

Sirma Business Consulting India Private Ltd.,

Website: sirmaglobal.com
Job details:
ob Title: Mobile Hardware & Chip-Level Repair Engineer (Contract â Immediate Joiner)

Location: Brookefield, Bangalore (Onsite)

Job Type: Contract

Contract Duration: 7 to 15 Days

Joining: Immediate Joiner Required

Job Description

We are looking for an experienced Mobile Hardware & Chip-Level Repair Engineer for a short-term onsite contract in Brookefield, Bangalore. The candidate must have complete knowledge of smartphone repair including hardware, software, soldering, and motherboard-level repair. The candidate should be able to independently diagnose and repair Android and iPhone devices.

Key Responsibilities

Diagnose and repair hardware and software issues in smartphones (Android and iPhone)

Perform chip-level repair including soldering and micro-soldering

Repair motherboard issues, IC replacement, and circuit repair

Replace display, battery, charging port, speaker, microphone, and camera

Repair damaged connectors and soldering connections

Handle water-damaged devices repair

Perform software flashing, OS installation, and firmware updates

Test devices after repair to ensure proper functionality

Required Skills

Strong experience in mobile hardware and chip-level repair

Expertise in soldering, hot air gun, and motherboard repair

Knowledge of Android and iPhone repair

Experience using tools like soldering station, microscope, multimeter

Ability to work independently

Experience Required: 1+ Years (Preferred)

Work Location: Brookefield, Bangalore (Onsite)

Immediate Joiners Only Click on Apply to know more.