Staff Process Engineer, Advanced Packaging CMP
Micron Technology
- Experience
- 5+ yrs
- Location
- Boise, Idaho, United States
- Job type
- Full-time
Required skills
- AMAT (LKP)
- EBARA-300X
- optical metrology
- profilometry
- polishing slurries
- conditioners
- polishing pads
- FMEA
- 8D
- SPC/FDC
About the role
BS or MS in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry or Physics with 5+ years CMP experience in semiconductor industry; hands-on CMP equipment operation; understanding of integration impacts; excellent communication.
About Micron Technology
Global leader in memory and storage semiconductor solutions.
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