SR ENGINEER, Advanced Packaging Technology Development

As a senior engineer in Micron's Advanced Packaging Technology Development (APTD) group at Taiwan Taichung, you will be responsible for assembly process development and pathfinding project related activities for memory devices application. In this position, you will work with Micron engineers, technology partners and vendors to develop unit processes that meet device requirements for next-generation semiconductors, integrate processes as part of cross-functional teams. Additionally, you will address process issues with pilot line manufacturing and work on continuous improvements for manufacturability. RESPONSIBILITIES: Develop and lead assembly processes from the conceptual phase to high-volume production for highly complex package development challenges. Work closely with multiple cross functional teams including wafer bump process development team, process integration, packaging, and program integration team. Define the milestones and deliver the risk assessment, mitigation plan, with various resources. Select equipment and material to meet quality, reliability, cost, yield, and production targets. Interface with equipment and material suppliers inducing tool setup, BKM recipe develop, buyoff and continuous improvement activities. Able to work independently along with various projects inside of APTD team.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all.