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Research Intern

Salary

$0.03k - $0.04k

Min Experience

0 years

Location

Seattle, Washington, United States

JobType

internship

About the job

Info This job is sourced from a job board

About the role

Impinj is a leading RAIN RFID provider and Internet of Things pioneer. We're inventing ways to connect every thing to the Internet — including retail apparel, retail general merchandise, healthcare items, automobile parts, airline baggage, food and much more. With more than 100 billion items connected to date, and multiple Fortune 500 enterprises around the world using our platform, we solve for a better understanding of our world. If it's a thing, we're working to connect it. Join Impinj and help us realize our vision of a boundless IoT— connecting trillions of everyday items to the Internet. Team Overview: As a Research Intern in the Advanced Technology group, you will work with engineers, technologists, product managers, and external partners to help enrich your career focus in semiconductor technology to improve the sustainability of everyday items. This role offers the opportunity to conduct semiconductor research to enable next-generation RAIN RFID tag chips, while also making progress on the environmental impacts of this technology. The ideal candidate will have a strong foundation in semiconductor materials and device fabrication, as well as sustainability. What you will do: Conduct experimental research on sophisticated methods for accurately aligning and positioning semiconductor components on a variety of substrates Characterize and analyze materials and interface properties using microscopy, spectroscopy, and metrology tools Develop, document, and optimize lab-scale processes that support reliable die placement, bonding, and interconnect formation Support the development of internal processes for engaging external partners in R&D and sustainability-related projects Support an industry workgroup on e-waste, including researching regulatory content and developing marketing materials Support internal recycling efforts, including identifying recycling pathways for multi-material RAIN RFID inlays Work with multi-functional teams, including materials scientists, process engineers, equipment technicians, and product managers Prepare technical reports and presentations to communicate findings and support ongoing research initiatives What you will bring: Advanced degree or equivalent in Materials Science, Electrical Engineering, Applied Physics, Chemical Engineering, or a related field with relevant laboratory research experience Demonstrated research experience, ideally through a Ph.D. (preferred) or M.S. with at least 2 years' work experience Familiarity with semiconductor device structures and fabrication processes, wearable/smart-textile devices, IoT sensors and embedded devices, or similar Hands-on experience with tools or techniques relevant to chip-to-substrate precision handling and integration (e.g., flip-chip, pick-and-place, die attach, alignment systems) and inspection techniques, ideally including experience working in a cleanroom environment Knowledge of advanced packaging technologies or heterogeneous integration approaches Proven experience working independently in a fast-paced environment and the ability to self-manage innovative programs Interest in sustainability topics, recycling pathways, and relevant regulatory frameworks Experience with data management, critical analysis skills, and strong attention to detail Excellent written and verbal communication skills Interpersonal, organizational and relationship-building skills.

About the company

Impinj is a leading RAIN RFID provider and Internet of Things pioneer. We're inventing ways to connect every thing to the Internet — including retail apparel, retail general merchandise, healthcare items, automobile parts, airline baggage, food and much more. With more than 100 billion items connected to date, and multiple Fortune 500 enterprises around the world using our platform, we solve for a better understanding of our world. If it's a thing, we're working to connect it.

Skills

semiconductor
materials
device fabrication
sustainability
microscopy
spectroscopy
metrology
die placement
bonding
interconnect formation
r&d
recycling
data management
communication