HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology.
At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology.
We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another.
Our growing team is looking for an Integrated Photonics Design Engineer at Senior or Staff levelto lead process design kit (PDK) development for HyperLight’s co-packaged optics product line.This hands-on role, based at HyperLight's headquarters, collaborates very closely with our internal component design, process engineering, and test teams to drive PDK development and ensure fast time-to-market. In this role you will be involved in all product-related discussions and decisions that have direct impact on HyperLight's business. As part of your responsibilities, you will:
- Collaborate with our product team, foundries, and customers to define device component and fabrication process performance requirements for co-packaged optics applications
- Lead the end-to-end design and validation of high performance device components, in collaboration with other component designers and process engineers
- Own and maintain the process design kit (PDK) for our co-packaged optics platform
- Contribute to the development of design, layout and verification enablement toolsets in open source and commercial tools including GDSFactory, Cadence Virtuoso, Synopsys Optocompiler and ICV, and Siemens Calibre.