Datacenter MEP Field Engineer

Datacenter MEP Field Engineer 

Liquid Cooling & MEP Data Center Infrastructure | GPU Compute & HPC Environments 

THE ROLE 

Hands-on Field Engineer that owns liquid cooling and HVAC infrastructure in GPU compute environments. CDUs, direct-to-chip loops, facility water plants, precision air handling, power distribution, power chain assessment, Power analysis management at rack densities where miscalculations take hardware offline. 

PORTFOLIO (HIGHLY ADVANTAGEOUS) 

Show us projects you designed or delivered. CDU install docs, HVAC load calcs, One-Line Power Train diagrams, commissioning reports with thermal data, piping schematics, conduit installations, construction photos, capacity models. Personal site, portfolio, or reference list of completed facilities. 

CERTIFICATIONS 

 Any Journeyman MEP Trade License or higher. 

ROLE AND TASK OWNERSHIP 

• Evaluate and commission liquid cooling for GPU compute—CDUs, direct-to-chip cold plates, reardoor HX, immersion tanks, and chilled water plants. Size heat rejection from real TDP data, not marketing sheets. 

• PDU/UPS/XFR/ATS/STS Medium Voltage to Low Voltage transformation, inversion, rectification, power distribution one-lines. 

• CRAH/CRAC/CDUs, hot/cold aisle containment, economizers, humidification, and supplemental cooling for mixed air/liquid deployments. 

• Spec piping for liquid cooling loops—routing, glycol concentration, pump curves, flow balancing, filtration, expansion tanks, and leak detection. 

• Thermal validation under load—delta-T, flow rate verification, coolant pressure testing, refrigerant charge validation. 

• Coordinate with mechanical subs, vendors, and controls integrators. Catch trade conflicts before they become change orders. 

PREFERRED SKILLS AND RESPONSIBILITIES 

• DCIM/BAS integration for cooling monitoring and electrical capacity management. 

• Several years of datacenter mechanical/electrical installation, and commissioning. 

• Hands-on liquid cooling experience at 75+ kW/rack—CDUs, direct-to-chip, rear-door HX, or immersion. 

• Familiarity with N+1/2N redundancy architectures for cooling plants and concurrently maintainable designs. 

• Willing to travel for site surveys, construction oversight, and commissioning.