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Hardware Engineering Intern, BS/MS, Summer 2026

Salary

$81k - $107k

Min Experience

0 years

Location

Mountain View, CA, USA, Ann Arbor, MI, USA, Atlanta, GA, USA, Austin, TX, USA, Boulder, CO, USA, Cambridge, MA, USA, Bellevue, WA, USA, Chicago, IL, USA, Irvine, CA, USA, Kirkland, WA, USA, Los Angeles, CA, USA, Madison, WI, USA, New York, NY, USA, Palo Alto, CA, USA, Portland, OR, USA, Pittsburgh, PA, USA, Raleigh, NC, USA, Durham, NC, USA, Reston, VA, USA, Redmond, WA, USA, Redwood City, CA, USA, San Diego, CA, USA, Goleta, CA, USA, San Bruno, CA, USA, Seattle, WA, USA, San Francisco, CA, USA, San Jose, CA, USA, Santa Cruz, CA, USA, South San Francisco, CA, USA, Sunnyvale, CA, USA, Washington D.C., DC, USA

JobType

internship

About the job

Info This job is sourced from a job board

About the role

Please complete your application before November 7, 2025. Applications will be reviewed on a rolling basis and it's in a applicant's best interest to apply early. Timing on when you can hear back will vary and can take upwards of 90+ days. If you haven't heard from us in three months about your application, we likely proceeded with other candidates for the role. Participation in the internship program requires that you are located in the United States for the duration of the internship program. This internship is intended for students in their penultimate academic year, who are pursuing a Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Computer Engineering, Computer Science, or a related technical field. Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for this internship program. To start the application process, you will need an updated CV or resume and a current unofficial or official transcript in English. Click on the 'Apply' button on this page and provide the required materials in the appropriate sections (PDFs preferred): In the 'Resume Section:' attach an updated CV or resume. In the 'Education Section:' attach a current or recent unofficial or official transcript in English. Under 'Degree Status,' select 'Now attending' to upload a transcript. The AI and Infrastructure organization at Google designs, implements, and manages the hardware, software, machine learning, and systems infrastructure for all Google services (Search, YouTube, etc.) and Google Cloud. Our end users are Googlers, Cloud customers and the billions of people who use Google services around the world. We prioritize security, efficiency, and reliability across everything we do - from developing our latest TPUs to running a global network, while driving towards shaping the future of hyperscale computing. Our global impact spans software and hardware, including Google Cloud's Vertex AI, the leading AI platform for bringing Gemini models to enterprise customers. Applicants in the County of Los Angeles: Qualified applications with arrest or conviction records will be considered for employment in accordance with the Los Angeles County Fair Chance Ordinance for Employers and the California Fair Chance Act. Applicants in San Francisco: Qualified applications with arrest or conviction records will be considered for employment in accordance with the San Francisco Fair Chance Ordinance for Employers and the California Fair Chance Act. This role may also be located in our Playa Vista, CA campus.

About the company

Google is a global company and, in order to facilitate efficient collaboration and communication globally, English proficiency is a requirement for this internship program.

Skills

hardware system integration
board design
board bring-up
signal and power integrity
system validation
product design
mechanical
thermal
computer architecture
FPGAs
embedded systems
memory systems
FEA
CFD
modeling
simulation
power analysis
thermal analysis
prototyping
testing
debugging
data center systems
consumer electronics
device manufacturing
board layout
CAD
PCB design
CAD tools
NX
Creo
Solidworks
Systems Integration
electromechanical assemblies
manufacturing techniques
fabrication techniques
rapid prototyping
wireless
antenna
radio frequency
imaging
display
sensors
audio
charging power
batteries