Role Description :
• Advanced Smartphone PCB Repair: Execute complex PCB-level repairs on high-density smartphone boards with precision and reliability.
• Glued & Sandwich PCBA Repair: Handle specialized glued PCBA repair and sandwich PCBA repair activities, including delamination, reballing, and reconstruction.
• POP IC Expertise: Perform Package-on-Package (POP) IC removal, reballing, and replacement with zero-defect standards.
• Critical Component Troubleshooting: Diagnose and repair CPU, Memory (RAM/Storage), and PMIC (Power Management IC) failures.
• Software Debugging & Flashing: Utilize QRCT, QPST, and other diagnostic tools for software debugging, firmware flashing, and configuration recovery.
• RF & Network Analysis: Conduct RF troubleshooting using CMW (Communication Measurement Unit) and Spectrum Analyzer; analyze network, WiFi, RF, charging, and power-related failures.
• Signal & Circuit Analysis: Use CRO (Cathode Ray Oscilloscope) for signal integrity checking and detailed circuit analysis.
• Failure Analysis: Perform root cause failure analysis using Newton / Network analysis tools; prepare comprehensive failure analysis and corrective action reports.
• Component-Level Repair: Execute micro-soldering and component-level troubleshooting with high accuracy.
• Production Support: Support pilot runs, engineering issues, and critical production escalations; maintain repair quality and productivity targets.
• Continuous Improvement: Contribute to process optimization and knowledge sharing within the repair team.