Thermal Engineering Technical Leader

The application window has been extended and is expected to close on: 04/24/2025

Job posting may be removed earlier if the position is filled or if a sufficient number of applications are received.

Meet the Team

We are part of Cisco Common Hardware Group (CHG), focusing on data center switch product, with high bandwidth and high power density. We are looking for an exceptional Thermal Engineer to tackle the challenges of high-power ASIC’s, next generation cooling, and high-density I/O. We focus in various cooling solutions, from forced air, convection cooling to liquid cooling in Modular or fixed to rack platforms. You will work very closely with Hardware & mechanical Engineering, Product Management/Marketing, Product Operations team, Global Supplier Management (GSM), External Vendors/Suppliers, Manufacturing Operations, and CM partners.

Your Impact

The Thermal Engineer Technical Leader helps to conceptualize the design and develop innovative electronic systems from a thermal aspect. You will impact and shape the development of cutting-edge network gears and hardware designs. Use your strong technical background in computational fluid dynamic, acoustic and thermal knowledge to develop and innovate next generation cooling solution. This is not limited to forced air cooling, but also free convection, liquid cool solution, and beyond. You will collaborate with Cisco cross-functional teams to architect, define, build, and validate the Enterprise switches, high density I/O, and next generation ASIC cooling challenges.

Primary Responsibilities:

• Architect, design, and deliver electronic enclosure’s cooling solution per customer, marketing and specification of product requirements
• Work on current and next generation system designs for network switches, including modular and fixed platform
• Collaborate with ASIC and SI to create component level thermal modeling
• Drive consistent thermal methodologies, test spec, deliverables, and documentation across the Business Unit
• Mentor/coach team members on career development and provide development feedback
• Drive the resolution of issues from customer escalation, test, or manufacturing partners
• Define test scope/report and manage multiple projects per deliverable schedule
• Participate and/or take a lead role in Cisco’s Patent Program
• Interface cross-functionally and lead team collaboration extending beyond work group
• Support vendor in custom heatsink or fan development
• Assist with the evaluation and selection of new vendor
  
  

Minimum Qualifications

• Bachelor’s Degree in Thermal engineering or equivalent degree +8 years of work experience or Master's degree in Thermal Engineering or equivalent degree and +6 years of related experience
• 8+ years of work experience in electronic cooling solutions, including heatsink design, fan development, and thermal interface materials
• Prior experience with I/O technology, including ICM and optical transceivers like SFP, QSFP, QSFP-DD
• Experience with FloTHERM or other CFD modeling tools
  
  

Preferred Qualifications

• Experience with air-cooled and free convection compact switches
• Expertise with common CFD analysis tools in conjunction with dissemination of results clearly to inter-disciplinary team members
• Hands on experiences in wind tunnel and acoustic tests
• Ability to communicate thermal solutions at an executive level and influence the outcome
  
  

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We are part of Cisco Common Hardware Group (CHG), focusing on data center switch product, with high bandwidth and high power density.